{"id":9428396441837,"title":"MG Chemicals 4900 SAC305, 96.3% Tin, 0.7% Copper, 3% Silver, No Clean Non Leaded Solder, 0.032\" Diameter, 1\/4 lbs Spool 112G","handle":"mg-chemicals-4900-sac305-96-3-tin-0-7-copper-3-silver-no-clean-non-leaded-solder-0-032-diameter-1-4-lbs-spool-112g","description":"\u003ch3\u003eMG Chemicals 4900 SAC305, 96.3% Tin, 0.7% Copper, 3% Silver, No Clean Non Leaded Solder, 0.032\" Diameter, 1\/4 lbs Spool\u003c\/h3\u003e\n\u003cp id=\"b\"\u003eM.G. Chemicals no clean Lead-Free Solder was designed with 96.3 percent tin,\n0.7 percent copper and 3 percent silver alloys as a lead-free alternative for\nthe standard Tin and Lead solder. These alloys conform to the impurity\nrequirements of J-Std-006 and RoHS. Use this solder anywhere you would use\nnormal solder. M.G. Chemicals Unleaded Solder utilizes a state-of-the-art\nautomatic wire extrusion and wire drawing machines to manufacture consistent\nsolder. The introduction of flux core in the wire extrusion process involves\nconstant monitoring of flux percentage to ensure minimal flux voids and\nirregular wire. Typical flux percentage for our Unleaded Solder is 2.0-4.0\npercent. A unique flux system was specifically used for high temperature\nUnleaded alloys. It provides the fluxing activity levels that promote fast\nwetting action and maximum wetting spread. Utilizing synthetically refined\nresin and very effective activator that wets and spreads like an RA type. This\nspecial activator exhibits virtually no spattering. Activator conforms to\nJ-STD-004, REL0. Cleaning Flux core is a no clean formulation therefore the\nresidues do not need to be removed for typical applications. Ag content:\n2.8-3.2 percent . Cu content: 0.3-0.7 percent . Sn content: Balance. Flux\nclassification: ORL0. Copper mirror: no removal of copper film. Silver\nchromate: pass. Corrosion: pass. SIR JSTD-004,Pattern down: 2.33 x 10 11 ohms.\nSIR Bellcore (Telecordia): 6.12 x 10 11 ohms. Electromigration: pass. Post\nreflow flux residue: 55 percent . Acid value: 190-210. Flux residue dryness:\npass. Spitting of flux-cored solder: 0.30 percent . Solder spread : 130 mm2.\nMelting point: 217-221 degree C (422.6 - 429.8 degree F). Upper temperature\nlimit: do not to exceed 350 degree C (tip temperature). Wire diameter: 0.032\"\n(0.81 mm). Standard wire gauge: 21. Tolerance: +\/- 0.002\". Hardness, brinell:\n15HB. Coefficient of thermal expansion: pure Sn=23.5. Tensile strength: 4312\npsi. Density: 7.39 g\/cc.\u003c\/p\u003e \n\n\u003ch3\u003eProduct Features\u003c\/h3\u003e\n \u003cul class=\"a\"\u003e\n \u003cli\u003eLead Free \u0026amp; no clean soldering wire\u003c\/li\u003e\n \u003cli\u003eAlloy exceeds J-STD-006C and meets ASTM B 32 purity requirements\u003c\/li\u003e\n \u003cli\u003eFlux meets J-STD-004B\u003c\/li\u003e\n \u003cli\u003eThe resin spreads like rosin-activated flux\u003c\/li\u003e\n \u003cli\u003eAbout 14% longer by weight than leaded solder wires\u003c\/li\u003e\n \u003c\/ul\u003e","published_at":"2026-07-12T11:48:16+10:00","created_at":"2026-07-10T00:12:38+10:00","vendor":"MG Chemicals","type":"Solder","tags":["home_improvement_July2026"],"price":20100,"price_min":20100,"price_max":20100,"available":true,"price_varies":false,"compare_at_price":null,"compare_at_price_min":0,"compare_at_price_max":0,"compare_at_price_varies":false,"variants":[{"id":50262308356333,"title":"112G","option1":"112G","option2":null,"option3":null,"sku":"B008OA7SYE","requires_shipping":true,"taxable":true,"featured_image":null,"available":true,"name":"MG Chemicals 4900 SAC305, 96.3% Tin, 0.7% Copper, 3% Silver, No Clean Non Leaded Solder, 0.032\" Diameter, 1\/4 lbs Spool 112G - 112G","public_title":"112G","options":["112G"],"price":20100,"weight":132,"compare_at_price":null,"inventory_management":"shopify","barcode":"779008490013","requires_selling_plan":false,"selling_plan_allocations":[],"quantity_rule":{"min":1,"max":null,"increment":1}}],"images":["\/\/leoforward.com\/cdn\/shop\/files\/B008OA7SYE.jpg?v=1783606360","\/\/leoforward.com\/cdn\/shop\/files\/41UI4Uky12L.jpg?v=1783606360","\/\/leoforward.com\/cdn\/shop\/files\/81MqsqFPl1L.jpg?v=1783606361","\/\/leoforward.com\/cdn\/shop\/files\/81NwWKTB7CL.jpg?v=1783606360"],"featured_image":"\/\/leoforward.com\/cdn\/shop\/files\/B008OA7SYE.jpg?v=1783606360","options":["Size"],"media":[{"alt":null,"id":40827368374509,"position":1,"preview_image":{"aspect_ratio":1.0,"height":2560,"width":2560,"src":"\/\/leoforward.com\/cdn\/shop\/files\/B008OA7SYE.jpg?v=1783606360"},"aspect_ratio":1.0,"height":2560,"media_type":"image","src":"\/\/leoforward.com\/cdn\/shop\/files\/B008OA7SYE.jpg?v=1783606360","width":2560},{"alt":null,"id":40827368407277,"position":2,"preview_image":{"aspect_ratio":1.767,"height":283,"width":500,"src":"\/\/leoforward.com\/cdn\/shop\/files\/41UI4Uky12L.jpg?v=1783606360"},"aspect_ratio":1.767,"height":283,"media_type":"image","src":"\/\/leoforward.com\/cdn\/shop\/files\/41UI4Uky12L.jpg?v=1783606360","width":500},{"alt":null,"id":40827368440045,"position":3,"preview_image":{"aspect_ratio":0.773,"height":2560,"width":1978,"src":"\/\/leoforward.com\/cdn\/shop\/files\/81MqsqFPl1L.jpg?v=1783606361"},"aspect_ratio":0.773,"height":2560,"media_type":"image","src":"\/\/leoforward.com\/cdn\/shop\/files\/81MqsqFPl1L.jpg?v=1783606361","width":1978},{"alt":null,"id":40827368472813,"position":4,"preview_image":{"aspect_ratio":0.773,"height":2560,"width":1978,"src":"\/\/leoforward.com\/cdn\/shop\/files\/81NwWKTB7CL.jpg?v=1783606360"},"aspect_ratio":0.773,"height":2560,"media_type":"image","src":"\/\/leoforward.com\/cdn\/shop\/files\/81NwWKTB7CL.jpg?v=1783606360","width":1978}],"requires_selling_plan":false,"selling_plan_groups":[],"content":"\u003ch3\u003eMG Chemicals 4900 SAC305, 96.3% Tin, 0.7% Copper, 3% Silver, No Clean Non Leaded Solder, 0.032\" Diameter, 1\/4 lbs Spool\u003c\/h3\u003e\n\u003cp id=\"b\"\u003eM.G. Chemicals no clean Lead-Free Solder was designed with 96.3 percent tin,\n0.7 percent copper and 3 percent silver alloys as a lead-free alternative for\nthe standard Tin and Lead solder. These alloys conform to the impurity\nrequirements of J-Std-006 and RoHS. Use this solder anywhere you would use\nnormal solder. M.G. Chemicals Unleaded Solder utilizes a state-of-the-art\nautomatic wire extrusion and wire drawing machines to manufacture consistent\nsolder. The introduction of flux core in the wire extrusion process involves\nconstant monitoring of flux percentage to ensure minimal flux voids and\nirregular wire. Typical flux percentage for our Unleaded Solder is 2.0-4.0\npercent. A unique flux system was specifically used for high temperature\nUnleaded alloys. It provides the fluxing activity levels that promote fast\nwetting action and maximum wetting spread. Utilizing synthetically refined\nresin and very effective activator that wets and spreads like an RA type. This\nspecial activator exhibits virtually no spattering. Activator conforms to\nJ-STD-004, REL0. Cleaning Flux core is a no clean formulation therefore the\nresidues do not need to be removed for typical applications. Ag content:\n2.8-3.2 percent . Cu content: 0.3-0.7 percent . Sn content: Balance. Flux\nclassification: ORL0. Copper mirror: no removal of copper film. Silver\nchromate: pass. Corrosion: pass. SIR JSTD-004,Pattern down: 2.33 x 10 11 ohms.\nSIR Bellcore (Telecordia): 6.12 x 10 11 ohms. Electromigration: pass. Post\nreflow flux residue: 55 percent . Acid value: 190-210. Flux residue dryness:\npass. Spitting of flux-cored solder: 0.30 percent . Solder spread : 130 mm2.\nMelting point: 217-221 degree C (422.6 - 429.8 degree F). Upper temperature\nlimit: do not to exceed 350 degree C (tip temperature). Wire diameter: 0.032\"\n(0.81 mm). Standard wire gauge: 21. Tolerance: +\/- 0.002\". Hardness, brinell:\n15HB. Coefficient of thermal expansion: pure Sn=23.5. Tensile strength: 4312\npsi. Density: 7.39 g\/cc.\u003c\/p\u003e \n\n\u003ch3\u003eProduct Features\u003c\/h3\u003e\n \u003cul class=\"a\"\u003e\n \u003cli\u003eLead Free \u0026amp; no clean soldering wire\u003c\/li\u003e\n \u003cli\u003eAlloy exceeds J-STD-006C and meets ASTM B 32 purity requirements\u003c\/li\u003e\n \u003cli\u003eFlux meets J-STD-004B\u003c\/li\u003e\n \u003cli\u003eThe resin spreads like rosin-activated flux\u003c\/li\u003e\n \u003cli\u003eAbout 14% longer by weight than leaded solder wires\u003c\/li\u003e\n \u003c\/ul\u003e"}