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On top of that, the TG-50’s honeycomb\nstencil can help users to apply thermal compound for a neat and well-covered\nsurface which fits all CPUs.P\/N: CL-O024-GROSGM-ATHERMAL CONDUCTIVITY: 8\nW\/m-kCOLOR: GrayWEIGHT: 4gVISCOSITY: 47 Pa-sTHERMAL IMPEDANCE: 0.035°C -in\n\/WDENSITY: 2.9 g\/cm\u003c\/p\u003e \n\n\u003ch3\u003eProduct Features\u003c\/h3\u003e\n \u003cul class=\"a\"\u003e\n \u003cli\u003e[High Performance] Contains diamond powder for higher heat transfer providing a thermal conductivity of 8.0 W\/m-k.\u003c\/li\u003e\n \u003cli\u003e[All-In-One Application Kit] Includes tools to clean, prep, and install fresh thermal compound to your hardware.\u003c\/li\u003e\n \u003cli\u003e[Easy to Apply] Specially formulated to easily spread over the included honeycomb stencil for consistent compound application, providing a neat and well-covered CPU.\u003c\/li\u003e\n \u003cli\u003e[Sustainability and Safety] The TG-50 is a non-electrically conductive compound eliminating risk of short circuit and offers a longer lifespan minimizing dry-out or cracking.\u003c\/li\u003e\n \u003c\/ul\u003e\n\n\n\n\n","published_at":"2021-08-26T15:49:13+10:00","created_at":"2021-08-26T15:49:13+10:00","vendor":"Thermaltake","type":"Heatsinks","tags":["cocoon"],"price":13500,"price_min":13500,"price_max":13500,"available":true,"price_varies":false,"compare_at_price":null,"compare_at_price_min":0,"compare_at_price_max":0,"compare_at_price_varies":false,"variants":[{"id":40974749008027,"title":"TG-50","option1":"TG-50","option2":null,"option3":null,"sku":"B08FXYFR9P","requires_shipping":true,"taxable":true,"featured_image":null,"available":true,"name":"Thermaltake TG-50 High Performance CPU\/GPU Heatsink Thermal Compound | 4g | CL-O024-GROSGM-A - 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This thermal compound application kit includes a set of\neasily-applied tools for immediate use. On top of that, the TG-50’s honeycomb\nstencil can help users to apply thermal compound for a neat and well-covered\nsurface which fits all CPUs.P\/N: CL-O024-GROSGM-ATHERMAL CONDUCTIVITY: 8\nW\/m-kCOLOR: GrayWEIGHT: 4gVISCOSITY: 47 Pa-sTHERMAL IMPEDANCE: 0.035°C -in\n\/WDENSITY: 2.9 g\/cm\u003c\/p\u003e \n\n\u003ch3\u003eProduct Features\u003c\/h3\u003e\n \u003cul class=\"a\"\u003e\n \u003cli\u003e[High Performance] Contains diamond powder for higher heat transfer providing a thermal conductivity of 8.0 W\/m-k.\u003c\/li\u003e\n \u003cli\u003e[All-In-One Application Kit] Includes tools to clean, prep, and install fresh thermal compound to your hardware.\u003c\/li\u003e\n \u003cli\u003e[Easy to Apply] Specially formulated to easily spread over the included honeycomb stencil for consistent compound application, providing a neat and well-covered CPU.\u003c\/li\u003e\n \u003cli\u003e[Sustainability and Safety] The TG-50 is a non-electrically conductive compound eliminating risk of short circuit and offers a longer lifespan minimizing dry-out or cracking.\u003c\/li\u003e\n \u003c\/ul\u003e\n\n\n\n\n"}

Thermaltake TG-50 High Performance CPU/GPU Heatsink Thermal Compound | 4g | CL-O024-GROSGM-A

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Thermaltake TG-50 High Performance CPU/GPU Heatsink Thermal Compound | 4g | CL-O024-GROSGM-A

Style:TG-50 Designed to lower CPU temperatures effectively, TG-50 is a premium thermal compound which contains diamond powder to improve thermal conductivity to maximize heat transfer, providing a longer lifespan eliminating dry-out or cracking while in use. This thermal compound application kit includes a set of easily-applied tools for immediate use. On top of that, the TG-50’s honeycomb stencil can help users to apply thermal compound for a neat and well-covered surface which fits all CPUs.P/N: CL-O024-GROSGM-ATHERMAL CONDUCTIVITY: 8 W/m-kCOLOR: GrayWEIGHT: 4gVISCOSITY: 47 Pa-sTHERMAL IMPEDANCE: 0.035°C -in /WDENSITY: 2.9 g/cm

Product Features

  • [High Performance] Contains diamond powder for higher heat transfer providing a thermal conductivity of 8.0 W/m-k.
  • [All-In-One Application Kit] Includes tools to clean, prep, and install fresh thermal compound to your hardware.
  • [Easy to Apply] Specially formulated to easily spread over the included honeycomb stencil for consistent compound application, providing a neat and well-covered CPU.
  • [Sustainability and Safety] The TG-50 is a non-electrically conductive compound eliminating risk of short circuit and offers a longer lifespan minimizing dry-out or cracking.

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