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Kester 186 possess high thermal\nstability for soldering multi-layer assemblies which require higher\ntemperatures. Exposure to high preheat temperatures does not degrade\nsolubility of the residue in normal cleaning solvents. There is no surface\ninsulation resistance degradation caused by the flux residue. The use of a\nminimum of ionic activating agents and the inactive nature of the residue\npermits leaving the residue on circuit board assemblies for many applications.\nThe flux residue is also moisture and fungus resistant.\u003c\/p\u003e \n\n\u003ch3\u003eProduct Features\u003c\/h3\u003e\n \u003cul class=\"a\"\u003e\n \u003cli\u003eHigh thermal stability\u003c\/li\u003e\n \u003cli\u003eImproves soldering performance\u003c\/li\u003e\n \u003cli\u003eEliminates the need and expense of cleaning\u003c\/li\u003e\n \u003cli\u003eClassified as ROL0 per J-STD-004\u003c\/li\u003e\n \u003c\/ul\u003e\n\n\n\n\n","published_at":"2020-06-02T18:17:27+10:00","created_at":"2020-06-02T18:17:27+10:00","vendor":"Kester","type":"Soldering Flux","tags":["leo30"],"price":12500,"price_min":12500,"price_max":12500,"available":true,"price_varies":false,"compare_at_price":null,"compare_at_price_min":0,"compare_at_price_max":0,"compare_at_price_varies":false,"variants":[{"id":34482793447579,"title":"Default Title","option1":"Default Title","option2":null,"option3":null,"sku":"B0089ERAY8","requires_shipping":true,"taxable":true,"featured_image":null,"available":true,"name":"Kester 83-1097-2331 Organic Water Soluble Liquid Flux Pen for Lead-Bearing and Lead Free Alloy, 0.33 fl. oz.","public_title":null,"options":["Default Title"],"price":12500,"weight":23,"compare_at_price":null,"inventory_management":null,"barcode":"768249068563","requires_selling_plan":false,"selling_plan_allocations":[]}],"images":["\/\/leoforward.com\/cdn\/shop\/products\/B0089ERAY8.jpg?v=1650966174","\/\/leoforward.com\/cdn\/shop\/products\/21j9zDvfs4L.jpg?v=1622782230"],"featured_image":"\/\/leoforward.com\/cdn\/shop\/products\/B0089ERAY8.jpg?v=1650966174","options":["Title"],"media":[{"alt":" [AUSTRALIA] - Kester 83-1097-2331 Organic Water Soluble Liquid Flux Pen for Lead-Bearing and Lead Free Alloy, 0.33 fl. oz.","id":29638005850349,"position":1,"preview_image":{"aspect_ratio":1.0,"height":220,"width":220,"src":"\/\/leoforward.com\/cdn\/shop\/products\/B0089ERAY8.jpg?v=1650966174"},"aspect_ratio":1.0,"height":220,"media_type":"image","src":"\/\/leoforward.com\/cdn\/shop\/products\/B0089ERAY8.jpg?v=1650966174","width":220},{"alt":" [AUSTRALIA] - Kester 83-1097-2331 Organic Water Soluble Liquid Flux Pen for Lead-Bearing and Lead Free Alloy, 0.33 fl. oz.","id":9405647388827,"position":2,"preview_image":{"aspect_ratio":1.468,"height":235,"width":345,"src":"\/\/leoforward.com\/cdn\/shop\/products\/21j9zDvfs4L.jpg?v=1622782230"},"aspect_ratio":1.468,"height":235,"media_type":"image","src":"\/\/leoforward.com\/cdn\/shop\/products\/21j9zDvfs4L.jpg?v=1622782230","width":345}],"requires_selling_plan":false,"selling_plan_groups":[],"content":"\u003ch3\u003eKester 83-1097-2331 Organic Water Soluble Liquid Flux Pen for Lead-Bearing and Lead Free Alloy, 0.33 fl. oz.\u003c\/h3\u003e\n\u003cp id=\"b\"\u003eKester 186 Flux Pen is specifically designed for leaded and lead-free rework\nof conventional and surface mount circuit board assemblies. Kester 186 under\nMIL-F-14256, was QPL approved as Type RMA. Although the fluxing ability\napproaches that of Type RA flux, residues after soldering are non-corrosive\nand non-conductive. Kester 186 has been developed for use in critical\napplications where difficult assemblies are to be soldered, but process\nrequirements stipulate use of Type RMA flux. Kester 186 possess high thermal\nstability for soldering multi-layer assemblies which require higher\ntemperatures. Exposure to high preheat temperatures does not degrade\nsolubility of the residue in normal cleaning solvents. There is no surface\ninsulation resistance degradation caused by the flux residue. The use of a\nminimum of ionic activating agents and the inactive nature of the residue\npermits leaving the residue on circuit board assemblies for many applications.\nThe flux residue is also moisture and fungus resistant.\u003c\/p\u003e \n\n\u003ch3\u003eProduct Features\u003c\/h3\u003e\n \u003cul class=\"a\"\u003e\n \u003cli\u003eHigh thermal stability\u003c\/li\u003e\n \u003cli\u003eImproves soldering performance\u003c\/li\u003e\n \u003cli\u003eEliminates the need and expense of cleaning\u003c\/li\u003e\n \u003cli\u003eClassified as ROL0 per J-STD-004\u003c\/li\u003e\n \u003c\/ul\u003e\n\n\n\n\n"}
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Kester 83-1097-2331 Organic Water Soluble Liquid Flux Pen for Lead-Bearing and Lead Free Alloy, 0.33 fl. oz.

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$125.00 AUD
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Kester 83-1097-2331 Organic Water Soluble Liquid Flux Pen for Lead-Bearing and Lead Free Alloy, 0.33 fl. oz.

Kester 186 Flux Pen is specifically designed for leaded and lead-free rework of conventional and surface mount circuit board assemblies. Kester 186 under MIL-F-14256, was QPL approved as Type RMA. Although the fluxing ability approaches that of Type RA flux, residues after soldering are non-corrosive and non-conductive. Kester 186 has been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux. Kester 186 possess high thermal stability for soldering multi-layer assemblies which require higher temperatures. Exposure to high preheat temperatures does not degrade solubility of the residue in normal cleaning solvents. There is no surface insulation resistance degradation caused by the flux residue. The use of a minimum of ionic activating agents and the inactive nature of the residue permits leaving the residue on circuit board assemblies for many applications. The flux residue is also moisture and fungus resistant.

Product Features

  • High thermal stability
  • Improves soldering performance
  • Eliminates the need and expense of cleaning
  • Classified as ROL0 per J-STD-004

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