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{"id":7947208786157,"title":"GENNEL G109 10gram Thermal Conductive Glue, Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound, Heatsink Glue for LED GPU MOSFET Printer Chipset IC High Performance","handle":"gennel-g109-10gram-thermal-conductive-glue-silicone-glue-thermal-plaster-silicone-viscous-adhesive-compound-heatsink-glue-for-led-gpu-mosfet-printer-chipset-ic-high-performance","description":"\u003ch3\u003eGENNEL G109 10gram Thermal Conductive Glue, Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound, Heatsink Glue for LED GPU MOSFET Printer Chipset IC High Performance\u003c\/h3\u003e\n\u003cp id=\"b\"\u003eMelting capacity 0 (250 ℃ \/ 24Hours) Evaporation 0.001%\n(250 ℃ \/ 24Hours) Full Cure Time 24 Hours Thermal conductivity \u0026gt; 1.2W\/m-K\nThermal Impedance \u0026lt;0.06 Adhesion and tensile strength 2.1 (MPa) Insulation\ncoefficient \u0026gt; 5.1 Dissipation coefficient \u0026lt;0.005 Temperature resistance -60 ~\n250 ℃ Net Weight 10g Package Includes 1 x GENNEL G109 10g thermal glue\nFeatures: It has heat conducting properties, strong adhesion. Suitable for all\nheatsink without fixed clip. Helps disperse the heat from Chipset to heatsink\neffectively. Read more Wide range application It has good thermal conductivity\nand wide service temperature range(-60~250 degrees Celsius) Use for MOSFET,\nLED, heat sinks , North-south bridge, graphics card , Chipset, heat\ndissipation part, heat dissipation, electrical appliances, instruments and\nother industries. Read more The curing rateis related to the relative humidity\nand temperature in the air, the higher the temperature, the faster the curing\nspeed, and vice versa.Recommended coating thickness: 0.1-0.5mm, the thinner\nthe better.Please close the lid immediately after use to prevent the glue from\ncuring.Do not use thermal glue between CPU and HEATSINK. Read more\u003c\/p\u003e \n\n\u003ch3\u003eProduct Features\u003c\/h3\u003e\n \u003cul class=\"a\"\u003e\n \u003cli\u003eNon-Electrical Conductive,Non-corrosive ,Non-toxic,Suitable for all heatsink without fixed clip. It has heat conducting properties, strong adhesion. Helps disperse the heat from Chipset to heatsink effectively.\u003c\/li\u003e\n \u003cli\u003eUse for MOSFET, LED, heat sinks , North-south bridge, video card, Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries.\u003c\/li\u003e\n \u003cli\u003eIt has good thermal conductivity and wide service temperature range(-60~250 degrees Celsius)\u003c\/li\u003e\n \u003cli\u003eThermal conductivity:\u0026gt; 1.2W\/m-K, Do not use thermal glue \"between CPU and HEATSINK\"!\u003c\/li\u003e\n \u003cli\u003ePackage Includes : 1 x GENNEL G109 10g thermal glue\u003c\/li\u003e\n \u003c\/ul\u003e\n\n","published_at":"2022-09-18T20:26:36+10:00","created_at":"2022-09-18T20:26:39+10:00","vendor":"GENNEL","type":"Electrically Conductive Adhesives","tags":["workwarehouse"],"price":9100,"price_min":9100,"price_max":9100,"available":true,"price_varies":false,"compare_at_price":null,"compare_at_price_min":0,"compare_at_price_max":0,"compare_at_price_varies":false,"variants":[{"id":43328570360045,"title":"Default Title","option1":"Default Title","option2":null,"option3":null,"sku":"B072MSXHJD","requires_shipping":true,"taxable":true,"featured_image":null,"available":true,"name":"GENNEL G109 10gram Thermal Conductive Glue, Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound, Heatsink Glue for LED GPU MOSFET Printer Chipset IC High Performance","public_title":null,"options":["Default Title"],"price":9100,"weight":9,"compare_at_price":null,"inventory_management":null,"barcode":"605826628065","requires_selling_plan":false,"selling_plan_allocations":[]}],"images":["\/\/leoforward.com\/cdn\/shop\/products\/B072MSXHJD.jpg?v=1663496799","\/\/leoforward.com\/cdn\/shop\/products\/71B4hSqRE8L.jpg?v=1663496799","\/\/leoforward.com\/cdn\/shop\/products\/41p8SOIojdS.jpg?v=1663496799","\/\/leoforward.com\/cdn\/shop\/products\/51GswBEzFcL.jpg?v=1663496800"],"featured_image":"\/\/leoforward.com\/cdn\/shop\/products\/B072MSXHJD.jpg?v=1663496799","options":["Title"],"media":[{"alt":" [AUSTRALIA] - GENNEL G109 10gram Thermal Conductive Glue, Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound, Heatsink Glue for LED GPU MOSFET Printer Chipset IC High Performance","id":30416841605357,"position":1,"preview_image":{"aspect_ratio":1.0,"height":1000,"width":1000,"src":"\/\/leoforward.com\/cdn\/shop\/products\/B072MSXHJD.jpg?v=1663496799"},"aspect_ratio":1.0,"height":1000,"media_type":"image","src":"\/\/leoforward.com\/cdn\/shop\/products\/B072MSXHJD.jpg?v=1663496799","width":1000},{"alt":" [AUSTRALIA] - GENNEL G109 10gram Thermal Conductive Glue, Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound, Heatsink Glue for LED GPU MOSFET Printer Chipset IC High Performance","id":30416841638125,"position":2,"preview_image":{"aspect_ratio":1.0,"height":1000,"width":1000,"src":"\/\/leoforward.com\/cdn\/shop\/products\/71B4hSqRE8L.jpg?v=1663496799"},"aspect_ratio":1.0,"height":1000,"media_type":"image","src":"\/\/leoforward.com\/cdn\/shop\/products\/71B4hSqRE8L.jpg?v=1663496799","width":1000},{"alt":" [AUSTRALIA] - GENNEL G109 10gram Thermal Conductive Glue, Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound, Heatsink Glue for LED GPU MOSFET Printer Chipset IC High Performance","id":30416841670893,"position":3,"preview_image":{"aspect_ratio":1.0,"height":1000,"width":1000,"src":"\/\/leoforward.com\/cdn\/shop\/products\/41p8SOIojdS.jpg?v=1663496799"},"aspect_ratio":1.0,"height":1000,"media_type":"image","src":"\/\/leoforward.com\/cdn\/shop\/products\/41p8SOIojdS.jpg?v=1663496799","width":1000},{"alt":" [AUSTRALIA] - GENNEL G109 10gram Thermal Conductive Glue, Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound, Heatsink Glue for LED GPU MOSFET Printer Chipset IC High Performance","id":30416841703661,"position":4,"preview_image":{"aspect_ratio":1.0,"height":1500,"width":1500,"src":"\/\/leoforward.com\/cdn\/shop\/products\/51GswBEzFcL.jpg?v=1663496800"},"aspect_ratio":1.0,"height":1500,"media_type":"image","src":"\/\/leoforward.com\/cdn\/shop\/products\/51GswBEzFcL.jpg?v=1663496800","width":1500}],"requires_selling_plan":false,"selling_plan_groups":[],"content":"\u003ch3\u003eGENNEL G109 10gram Thermal Conductive Glue, Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound, Heatsink Glue for LED GPU MOSFET Printer Chipset IC High Performance\u003c\/h3\u003e\n\u003cp id=\"b\"\u003eMelting capacity 0 (250 ℃ \/ 24Hours) Evaporation 0.001%\n(250 ℃ \/ 24Hours) Full Cure Time 24 Hours Thermal conductivity \u0026gt; 1.2W\/m-K\nThermal Impedance \u0026lt;0.06 Adhesion and tensile strength 2.1 (MPa) Insulation\ncoefficient \u0026gt; 5.1 Dissipation coefficient \u0026lt;0.005 Temperature resistance -60 ~\n250 ℃ Net Weight 10g Package Includes 1 x GENNEL G109 10g thermal glue\nFeatures: It has heat conducting properties, strong adhesion. Suitable for all\nheatsink without fixed clip. Helps disperse the heat from Chipset to heatsink\neffectively. Read more Wide range application It has good thermal conductivity\nand wide service temperature range(-60~250 degrees Celsius) Use for MOSFET,\nLED, heat sinks , North-south bridge, graphics card , Chipset, heat\ndissipation part, heat dissipation, electrical appliances, instruments and\nother industries. Read more The curing rateis related to the relative humidity\nand temperature in the air, the higher the temperature, the faster the curing\nspeed, and vice versa.Recommended coating thickness: 0.1-0.5mm, the thinner\nthe better.Please close the lid immediately after use to prevent the glue from\ncuring.Do not use thermal glue between CPU and HEATSINK. Read more\u003c\/p\u003e \n\n\u003ch3\u003eProduct Features\u003c\/h3\u003e\n \u003cul class=\"a\"\u003e\n \u003cli\u003eNon-Electrical Conductive,Non-corrosive ,Non-toxic,Suitable for all heatsink without fixed clip. It has heat conducting properties, strong adhesion. Helps disperse the heat from Chipset to heatsink effectively.\u003c\/li\u003e\n \u003cli\u003eUse for MOSFET, LED, heat sinks , North-south bridge, video card, Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries.\u003c\/li\u003e\n \u003cli\u003eIt has good thermal conductivity and wide service temperature range(-60~250 degrees Celsius)\u003c\/li\u003e\n \u003cli\u003eThermal conductivity:\u0026gt; 1.2W\/m-K, Do not use thermal glue \"between CPU and HEATSINK\"!\u003c\/li\u003e\n \u003cli\u003ePackage Includes : 1 x GENNEL G109 10g thermal glue\u003c\/li\u003e\n \u003c\/ul\u003e\n\n"}

GENNEL G109 10gram Thermal Conductive Glue, Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound, Heatsink Glue for LED GPU MOSFET Printer Chipset IC High Performance

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GENNEL G109 10gram Thermal Conductive Glue, Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound, Heatsink Glue for LED GPU MOSFET Printer Chipset IC High Performance

Melting capacity 0 (250 ℃ / 24Hours) Evaporation 0.001% (250 ℃ / 24Hours) Full Cure Time 24 Hours Thermal conductivity > 1.2W/m-K Thermal Impedance <0.06 Adhesion and tensile strength 2.1 (MPa) Insulation coefficient > 5.1 Dissipation coefficient <0.005 Temperature resistance -60 ~ 250 ℃ Net Weight 10g Package Includes 1 x GENNEL G109 10g thermal glue Features: It has heat conducting properties, strong adhesion. Suitable for all heatsink without fixed clip. Helps disperse the heat from Chipset to heatsink effectively. Read more Wide range application It has good thermal conductivity and wide service temperature range(-60~250 degrees Celsius) Use for MOSFET, LED, heat sinks , North-south bridge, graphics card , Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries. Read more The curing rateis related to the relative humidity and temperature in the air, the higher the temperature, the faster the curing speed, and vice versa.Recommended coating thickness: 0.1-0.5mm, the thinner the better.Please close the lid immediately after use to prevent the glue from curing.Do not use thermal glue between CPU and HEATSINK. Read more

Product Features

  • Non-Electrical Conductive,Non-corrosive ,Non-toxic,Suitable for all heatsink without fixed clip. It has heat conducting properties, strong adhesion. Helps disperse the heat from Chipset to heatsink effectively.
  • Use for MOSFET, LED, heat sinks , North-south bridge, video card, Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries.
  • It has good thermal conductivity and wide service temperature range(-60~250 degrees Celsius)
  • Thermal conductivity:> 1.2W/m-K, Do not use thermal glue "between CPU and HEATSINK"!
  • Package Includes : 1 x GENNEL G109 10g thermal glue