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{"id":7047245234331,"title":"BCZAMD 3D Printer Mainboard Parts Heatsink Plaster Thermal Conductive Glue Viscous Silicone Adhesive Cooling Compound for LED GPU Chipset CPU IC PC, 5G x 3Pcs","handle":"bczamd-3d-printer-mainboard-parts-heatsink-plaster-thermal-conductive-glue-viscous-silicone-adhesive-cooling-compound-for-led-gpu-chipset-cpu-ic-pc-5g-x-3pcs","description":"\u003ch3\u003eBCZAMD 3D Printer Mainboard Parts Heatsink Plaster Thermal Conductive Glue Viscous Silicone Adhesive Cooling Compound for LED GPU Chipset CPU IC PC, 5G x 3Pcs\u003c\/h3\u003e\n\u003cp id=\"b\"\u003eApplication: 1.Heat dissipation of electronic appliances, power supply,\nbonding of transistors. 2.Thermistor heat-dissipating sealing, PTC bonding\ninsulation. 3.Adhesive sealing and heat dissipation with high thermal\nconductivity. 4.Bonding and sealing of high-power LEDs and lamp beads.\n5.Household appliances, electronic components, electricians. Specification:\nSpecific quantity: [ 25 ° C (770 F)] \u0026gt; 2.3 Heat transfer coefficient: W\/m-k\n\u0026gt;0.975 Thermal impedance: c-in\/W \u0026lt;0.246 Arc resistance: seconds 120 Dry time:\n[25 °C] 5~15min Bonding strength: 1.8Mpa Insulation coefficient: 100Hz\/Kvac\n5.1 1000Hz\/Kvac 5.0 Notes: 1.When using, directly extrude the product, rub it\nwith the surface of the adherend, and cover it immediately after use, in case\nof trial again; 2.The surface fixed speed is related to the relative humidity\nand temperature in the air; higher temperature, faster curing speed, and vice\nversa; 3.The recommended thickness of the application: 0.1-0.5mm, the thinner\nthe better; 4.Please clean the surface of the bonded object before use (such\nas alcohol), avoid cleaning with detergent, and apply it after the surface is\nclean. Package includes: 3 x Thermal Glue\u003c\/p\u003e \n\n\u003ch3\u003eProduct Features\u003c\/h3\u003e\n \u003cul class=\"a\"\u003e\n \u003cli\u003eThis heatsink plaster is high thermal conductivity, low leakage and high temperature stability\u003c\/li\u003e\n \u003cli\u003eApply to 3d printer heatsink, CUP, LED, IC, GPU Chipset, PC Heatsink and all kinds of electronic component that need to be directly bonded firmly\u003c\/li\u003e\n \u003cli\u003eThe thermal adhesive is thermal properties, strong adhesion to most metals and non-metals, odorless, non-toxic, moisture-proof, non-swelling, non-corrosive to substrate\u003c\/li\u003e\n \u003cli\u003eQuickly solidifies after exposure to air. Dry time: [25 C] about 30min\u003c\/li\u003e\n \u003cli\u003eAfter-sales guarantee: each defective item can be replacement for free or refund. If any question, please feel free to contact or QA us, we will try our best to service you\u003c\/li\u003e\n \u003c\/ul\u003e\n\n\n\n\n","published_at":"2021-09-06T15:42:35+10:00","created_at":"2021-09-06T15:42:35+10:00","vendor":"BCZAMD","type":"Heatsinks","tags":["cocoon"],"price":11800,"price_min":11800,"price_max":11800,"available":true,"price_varies":false,"compare_at_price":null,"compare_at_price_min":0,"compare_at_price_max":0,"compare_at_price_varies":false,"variants":[{"id":41062854328475,"title":"Default Title","option1":"Default Title","option2":null,"option3":null,"sku":"B07R1GYQ1Q","requires_shipping":true,"taxable":true,"featured_image":null,"available":true,"name":"BCZAMD 3D Printer Mainboard Parts Heatsink Plaster Thermal Conductive Glue Viscous Silicone Adhesive Cooling Compound for LED GPU Chipset CPU IC PC, 5G x 3Pcs","public_title":null,"options":["Default Title"],"price":11800,"weight":45,"compare_at_price":null,"inventory_management":null,"barcode":"AiUS Heatsink Glue","requires_selling_plan":false,"selling_plan_allocations":[]}],"images":["\/\/leoforward.com\/cdn\/shop\/products\/B07R1GYQ1Q.jpg?v=1651403292","\/\/leoforward.com\/cdn\/shop\/products\/51Di4q7ymPL.jpg?v=1634834437","\/\/leoforward.com\/cdn\/shop\/products\/51NgmrG7wIL.jpg?v=1634834437","\/\/leoforward.com\/cdn\/shop\/products\/41Mfq-rFuxL.jpg?v=1634834438","\/\/leoforward.com\/cdn\/shop\/products\/518_2TM56OL.jpg?v=1634834438","\/\/leoforward.com\/cdn\/shop\/products\/51QBQ1OY8OL.jpg?v=1634834438","\/\/leoforward.com\/cdn\/shop\/products\/5123pzRfy-L.jpg?v=1634834438","\/\/leoforward.com\/cdn\/shop\/products\/51z1x9T_FWL.jpg?v=1634834438"],"featured_image":"\/\/leoforward.com\/cdn\/shop\/products\/B07R1GYQ1Q.jpg?v=1651403292","options":["Title"],"media":[{"alt":"BCZAMD 3D Printer Mainboard Parts Heatsink Plaster Thermal Conductive Glue Viscous Silicone Adhesive Cooling Compound for LED GPU Chipset CPU IC PC, 5G x 3Pcs - 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Specification:\nSpecific quantity: [ 25 ° C (770 F)] \u0026gt; 2.3 Heat transfer coefficient: W\/m-k\n\u0026gt;0.975 Thermal impedance: c-in\/W \u0026lt;0.246 Arc resistance: seconds 120 Dry time:\n[25 °C] 5~15min Bonding strength: 1.8Mpa Insulation coefficient: 100Hz\/Kvac\n5.1 1000Hz\/Kvac 5.0 Notes: 1.When using, directly extrude the product, rub it\nwith the surface of the adherend, and cover it immediately after use, in case\nof trial again; 2.The surface fixed speed is related to the relative humidity\nand temperature in the air; higher temperature, faster curing speed, and vice\nversa; 3.The recommended thickness of the application: 0.1-0.5mm, the thinner\nthe better; 4.Please clean the surface of the bonded object before use (such\nas alcohol), avoid cleaning with detergent, and apply it after the surface is\nclean. Package includes: 3 x Thermal Glue\u003c\/p\u003e \n\n\u003ch3\u003eProduct Features\u003c\/h3\u003e\n \u003cul class=\"a\"\u003e\n \u003cli\u003eThis heatsink plaster is high thermal conductivity, low leakage and high temperature stability\u003c\/li\u003e\n \u003cli\u003eApply to 3d printer heatsink, CUP, LED, IC, GPU Chipset, PC Heatsink and all kinds of electronic component that need to be directly bonded firmly\u003c\/li\u003e\n \u003cli\u003eThe thermal adhesive is thermal properties, strong adhesion to most metals and non-metals, odorless, non-toxic, moisture-proof, non-swelling, non-corrosive to substrate\u003c\/li\u003e\n \u003cli\u003eQuickly solidifies after exposure to air. Dry time: [25 C] about 30min\u003c\/li\u003e\n \u003cli\u003eAfter-sales guarantee: each defective item can be replacement for free or refund. If any question, please feel free to contact or QA us, we will try our best to service you\u003c\/li\u003e\n \u003c\/ul\u003e\n\n\n\n\n"}

BCZAMD 3D Printer Mainboard Parts Heatsink Plaster Thermal Conductive Glue Viscous Silicone Adhesive Cooling Compound for LED GPU Chipset CPU IC PC, 5G x 3Pcs

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BCZAMD 3D Printer Mainboard Parts Heatsink Plaster Thermal Conductive Glue Viscous Silicone Adhesive Cooling Compound for LED GPU Chipset CPU IC PC, 5G x 3Pcs

Application: 1.Heat dissipation of electronic appliances, power supply, bonding of transistors. 2.Thermistor heat-dissipating sealing, PTC bonding insulation. 3.Adhesive sealing and heat dissipation with high thermal conductivity. 4.Bonding and sealing of high-power LEDs and lamp beads. 5.Household appliances, electronic components, electricians. Specification: Specific quantity: [ 25 ° C (770 F)] > 2.3 Heat transfer coefficient: W/m-k >0.975 Thermal impedance: c-in/W <0.246 Arc resistance: seconds 120 Dry time: [25 °C] 5~15min Bonding strength: 1.8Mpa Insulation coefficient: 100Hz/Kvac 5.1 1000Hz/Kvac 5.0 Notes: 1.When using, directly extrude the product, rub it with the surface of the adherend, and cover it immediately after use, in case of trial again; 2.The surface fixed speed is related to the relative humidity and temperature in the air; higher temperature, faster curing speed, and vice versa; 3.The recommended thickness of the application: 0.1-0.5mm, the thinner the better; 4.Please clean the surface of the bonded object before use (such as alcohol), avoid cleaning with detergent, and apply it after the surface is clean. Package includes: 3 x Thermal Glue

Product Features

  • This heatsink plaster is high thermal conductivity, low leakage and high temperature stability
  • Apply to 3d printer heatsink, CUP, LED, IC, GPU Chipset, PC Heatsink and all kinds of electronic component that need to be directly bonded firmly
  • The thermal adhesive is thermal properties, strong adhesion to most metals and non-metals, odorless, non-toxic, moisture-proof, non-swelling, non-corrosive to substrate
  • Quickly solidifies after exposure to air. Dry time: [25 C] about 30min
  • After-sales guarantee: each defective item can be replacement for free or refund. If any question, please feel free to contact or QA us, we will try our best to service you

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