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{"id":7008059785371,"title":"GENNEL 10g Thermal Conductive Glue, Heatsink Glue, Thermal Adhesive for 3D Printer, LED, PC and Various Electronic Components That Need to Be Bonded - G109","handle":"gennel-10g-thermal-conductive-glue-heatsink-glue-thermal-adhesive-for-3d-printer-led-pc-and-various-electronic-components-that-need-to-be-bonded-g109","description":"\u003ch3\u003eGENNEL 10g Thermal Conductive Glue, Heatsink Glue, Thermal Adhesive for 3D Printer, LED, PC and Various Electronic Components That Need to Be Bonded - G109\u003c\/h3\u003e\n\u003cp id=\"b\"\u003eGENNEL G109 - Thermal conductive adhesive has good thermal conductivity and\nstrong adhesion to most metals and plastics. It is suitable for 3D printers,\nLED, heat sinks, power supplies, transistors, north-south bridges, PC,\nelectrical appliances and various electronic components that need to be firmly\nbonded. Special reminder: Please do not use thermal glue between “CPU and heat\nsink”! Because the thermal glue is difficult to separate after curing, forced\nseparation may damage the CPU, so please remember. Thermal paste should be\nused between the CPU and the heat sink. You can search for it on Amazon\n(B07V4C918W), this is our most popular thermal paste. The thermal conductive\nglue will start to solidify when exposed to the air, so please seal the rest\nimmediately after use to prevent it from curing. Specification: Melting\nCapacity: 0 (250 ℃ \/ 24Hours) Evaporation: 0.001% (250 ℃ \/ 24Hours) \nThermal Conductivity: \u0026gt; 1.2W\/m-K Thermal Impedance: \u0026lt;0.06 Insulation\nCoefficient: 100Hz\/Kvac 5.1 1000Hz\/Kvac 5.0 Dissipation Coefficient: \u0026lt;0.005\n Temperature Resistance: -60 ~ 250 ℃ Color: White Net Weight: 10g Package\nIncludes: 1 x 10g Thermal Conductive Glue.\u003c\/p\u003e \n\n\u003ch3\u003eProduct Features\u003c\/h3\u003e\n \u003cul class=\"a\"\u003e\n \u003cli\u003eGENNEL thermal conductive glue has good thermal conductivity, strong adhesion to most metals and plastics, non-toxic, moisture-proof, non-swelling, non-corrosive to the substrate\u003c\/li\u003e\n \u003cli\u003eSuitable for 3D printer's, LED, heat sinks, power supply, transistor, north-south bridge, PC, electrical appliances and various electronic components that need to be firmly bonded\u003c\/li\u003e\n \u003cli\u003eDo not use thermal glue between the CPU and heat sink! Because the thermal glue is difficult to separate after curing, forced separation may damage the CPU, so please remember. Thermal paste should be used between the CPU and the heat sink, you can search to see (B07V4C918W)\u003c\/li\u003e\n \u003cli\u003eThe thermal conductive glue begins to cure after being exposed to air. Drying time: [25C] about 24 hours, it is recommended to stand for a long enough time after bonding, so as not to affect the firmness and integrity of the bonding\u003c\/li\u003e\n \u003cli\u003eThe curing speed of the thermal glue is related to the relative humidity and temperature in the air. The higher the temperature, the faster the curing speed, and vice versa\u003c\/li\u003e\n \u003c\/ul\u003e\n\n\n\n\n","published_at":"2021-08-21T20:52:45+10:00","created_at":"2021-08-21T20:52:45+10:00","vendor":"Gubar","type":"Heatsinks","tags":["cocoon","deletenow"],"price":11100,"price_min":11100,"price_max":11100,"available":true,"price_varies":false,"compare_at_price":null,"compare_at_price_min":0,"compare_at_price_max":0,"compare_at_price_varies":false,"variants":[{"id":40923359117467,"title":"Default Title","option1":"Default Title","option2":null,"option3":null,"sku":"B07TSH6MNT","requires_shipping":true,"taxable":true,"featured_image":null,"available":true,"name":"GENNEL 10g Thermal Conductive Glue, Heatsink Glue, Thermal Adhesive for 3D Printer, LED, PC and Various Electronic Components That Need to Be Bonded - G109","public_title":null,"options":["Default Title"],"price":11100,"weight":9,"compare_at_price":null,"inventory_management":null,"barcode":"GENNEL G109","requires_selling_plan":false,"selling_plan_allocations":[]}],"images":["\/\/leoforward.com\/cdn\/shop\/products\/B07TSH6MNT.jpg?v=1651364639","\/\/leoforward.com\/cdn\/shop\/products\/619w3oMYuLL.jpg?v=1629995077","\/\/leoforward.com\/cdn\/shop\/products\/71B-41tg1eL.jpg?v=1629995077","\/\/leoforward.com\/cdn\/shop\/products\/611-RqFg8yL.jpg?v=1629995077","\/\/leoforward.com\/cdn\/shop\/products\/71JDjpEnXwL.jpg?v=1629995077","\/\/leoforward.com\/cdn\/shop\/products\/61O_bQX3NhL.jpg?v=1629995077"],"featured_image":"\/\/leoforward.com\/cdn\/shop\/products\/B07TSH6MNT.jpg?v=1651364639","options":["Title"],"media":[{"alt":"GENNEL 10g Thermal Conductive Glue, Heatsink Glue, Thermal Adhesive for 3D Printer, LED, PC and Various Electronic Components That Need to Be Bonded - 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G109\u003c\/h3\u003e\n\u003cp id=\"b\"\u003eGENNEL G109 - Thermal conductive adhesive has good thermal conductivity and\nstrong adhesion to most metals and plastics. It is suitable for 3D printers,\nLED, heat sinks, power supplies, transistors, north-south bridges, PC,\nelectrical appliances and various electronic components that need to be firmly\nbonded. Special reminder: Please do not use thermal glue between “CPU and heat\nsink”! Because the thermal glue is difficult to separate after curing, forced\nseparation may damage the CPU, so please remember. Thermal paste should be\nused between the CPU and the heat sink. You can search for it on Amazon\n(B07V4C918W), this is our most popular thermal paste. The thermal conductive\nglue will start to solidify when exposed to the air, so please seal the rest\nimmediately after use to prevent it from curing. Specification: Melting\nCapacity: 0 (250 ℃ \/ 24Hours) Evaporation: 0.001% (250 ℃ \/ 24Hours) \nThermal Conductivity: \u0026gt; 1.2W\/m-K Thermal Impedance: \u0026lt;0.06 Insulation\nCoefficient: 100Hz\/Kvac 5.1 1000Hz\/Kvac 5.0 Dissipation Coefficient: \u0026lt;0.005\n Temperature Resistance: -60 ~ 250 ℃ Color: White Net Weight: 10g Package\nIncludes: 1 x 10g Thermal Conductive Glue.\u003c\/p\u003e \n\n\u003ch3\u003eProduct Features\u003c\/h3\u003e\n \u003cul class=\"a\"\u003e\n \u003cli\u003eGENNEL thermal conductive glue has good thermal conductivity, strong adhesion to most metals and plastics, non-toxic, moisture-proof, non-swelling, non-corrosive to the substrate\u003c\/li\u003e\n \u003cli\u003eSuitable for 3D printer's, LED, heat sinks, power supply, transistor, north-south bridge, PC, electrical appliances and various electronic components that need to be firmly bonded\u003c\/li\u003e\n \u003cli\u003eDo not use thermal glue between the CPU and heat sink! Because the thermal glue is difficult to separate after curing, forced separation may damage the CPU, so please remember. Thermal paste should be used between the CPU and the heat sink, you can search to see (B07V4C918W)\u003c\/li\u003e\n \u003cli\u003eThe thermal conductive glue begins to cure after being exposed to air. Drying time: [25C] about 24 hours, it is recommended to stand for a long enough time after bonding, so as not to affect the firmness and integrity of the bonding\u003c\/li\u003e\n \u003cli\u003eThe curing speed of the thermal glue is related to the relative humidity and temperature in the air. The higher the temperature, the faster the curing speed, and vice versa\u003c\/li\u003e\n \u003c\/ul\u003e\n\n\n\n\n"}

GENNEL 10g Thermal Conductive Glue, Heatsink Glue, Thermal Adhesive for 3D Printer, LED, PC and Various Electronic Components That Need to Be Bonded - G109

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GENNEL 10g Thermal Conductive Glue, Heatsink Glue, Thermal Adhesive for 3D Printer, LED, PC and Various Electronic Components That Need to Be Bonded - G109

GENNEL G109 - Thermal conductive adhesive has good thermal conductivity and strong adhesion to most metals and plastics. It is suitable for 3D printers, LED, heat sinks, power supplies, transistors, north-south bridges, PC, electrical appliances and various electronic components that need to be firmly bonded. Special reminder: Please do not use thermal glue between “CPU and heat sink”! Because the thermal glue is difficult to separate after curing, forced separation may damage the CPU, so please remember. Thermal paste should be used between the CPU and the heat sink. You can search for it on Amazon (B07V4C918W), this is our most popular thermal paste. The thermal conductive glue will start to solidify when exposed to the air, so please seal the rest immediately after use to prevent it from curing. Specification: Melting Capacity: 0 (250 ℃ / 24Hours) Evaporation: 0.001% (250 ℃ / 24Hours) Thermal Conductivity: > 1.2W/m-K Thermal Impedance: <0.06 Insulation Coefficient: 100Hz/Kvac 5.1 1000Hz/Kvac 5.0 Dissipation Coefficient: <0.005 Temperature Resistance: -60 ~ 250 ℃ Color: White Net Weight: 10g Package Includes: 1 x 10g Thermal Conductive Glue.

Product Features

  • GENNEL thermal conductive glue has good thermal conductivity, strong adhesion to most metals and plastics, non-toxic, moisture-proof, non-swelling, non-corrosive to the substrate
  • Suitable for 3D printer's, LED, heat sinks, power supply, transistor, north-south bridge, PC, electrical appliances and various electronic components that need to be firmly bonded
  • Do not use thermal glue between the CPU and heat sink! Because the thermal glue is difficult to separate after curing, forced separation may damage the CPU, so please remember. Thermal paste should be used between the CPU and the heat sink, you can search to see (B07V4C918W)
  • The thermal conductive glue begins to cure after being exposed to air. Drying time: [25C] about 24 hours, it is recommended to stand for a long enough time after bonding, so as not to affect the firmness and integrity of the bonding
  • The curing speed of the thermal glue is related to the relative humidity and temperature in the air. The higher the temperature, the faster the curing speed, and vice versa

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