Enter FORWARD5 at Checkout for 5% OFF & Free Shipping in Australia

{"id":5274311622811,"title":"Solder Paste no clean Sn96.5\/Ag3.0\/Cu0.5 Two Part Mix 15g (T4)","handle":"solder-paste-no-clean-sn96-5-ag3-0-cu0-5-two-part-mix-15g-t4","description":"\u003ch3\u003eSolder Paste no clean Sn96.5\/Ag3.0\/Cu0.5 Two Part Mix 15g (T4)\u003c\/h3\u003e\n\u003cp id=\"b\"\u003eDescription Solder Paste No-Clean Lead-Free SAC305 T4 mesh 15g Two Part Mix.\nAlloy: Sn96.5\/Ag3.0\/Cu0.5 Flux Type: Synthetic No-Clean Flux Classification:\nREL0 Metal Content: 87% metal by weight. Particle Size: T4 (20-38 microns)\nMelting Point: 217-220C (423-428F) Size: 15g Two Part Mix Shelf Life Before\nMixed: Refrigerated \u0026gt;24 months, unrefrigerated \u0026gt;24 months After Mixed:\nRefrigerated \u0026gt;6 months, unrefrigerated \u0026gt;2 months Stencil Life \u0026gt;8 hours @\n20-50% RH 22-28C (72-82F) \u0026gt;4 hours @ 50-70% RH 22-28C (72-82F) Stencil\nCleaning Automated stencil cleaning systems for both stencil and misprinted\nboards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling\nBefore Mixed: Store refrigerated or at room temperature 3-25C (37-77F). Do not\nfreeze. After Mixed: Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4\nhours for solder paste to reach an operating temperature of 20-25C (68-77F)\nbefore use. Once mixed, the solder paste can be dispensed by cutting a small\ncorner off the bag. It can be resealed with a piece of tape, or it can be\nstored by dispensing the entire bag into the provided empty jar.\nTransportation This product has no shipping restrictions. Shipping below 0C\n(32F) or above 25C (77F) for normal transit times by ground or air will not\nimpact this product's stated shelf life.\u003c\/p\u003e \n\n\u003ch3\u003eProduct Features\u003c\/h3\u003e\n \u003cul class=\"a\"\u003e\n \u003cli\u003eLead-Free \/ RoHS Compliant\u003c\/li\u003e\n \u003cli\u003eTwo-Part Mix\u003c\/li\u003e\n \u003c\/ul\u003e\n\n\n\n\n","published_at":"2020-06-07T12:41:11+10:00","created_at":"2020-06-07T12:41:11+10:00","vendor":"Chip Quik","type":"Solder","tags":["deletenow","leo30","no_prime_third_party"],"price":15200,"price_min":15200,"price_max":15200,"available":true,"price_varies":false,"compare_at_price":null,"compare_at_price_min":0,"compare_at_price_max":0,"compare_at_price_varies":false,"variants":[{"id":34550586441883,"title":"Default Title","option1":"Default Title","option2":null,"option3":null,"sku":"B07BS4V1B9","requires_shipping":true,"taxable":true,"featured_image":null,"available":true,"name":"Solder Paste no clean Sn96.5\/Ag3.0\/Cu0.5 Two Part Mix 15g (T4)","public_title":null,"options":["Default Title"],"price":15200,"weight":40,"compare_at_price":null,"inventory_management":null,"barcode":"0700254126661","requires_selling_plan":false,"selling_plan_allocations":[]}],"images":["\/\/leoforward.com\/cdn\/shop\/products\/B07BS4V1B9.jpg?v=1650978554"],"featured_image":"\/\/leoforward.com\/cdn\/shop\/products\/B07BS4V1B9.jpg?v=1650978554","options":["Title"],"media":[{"alt":" [AUSTRALIA] - Solder Paste no clean Sn96.5\/Ag3.0\/Cu0.5 Two Part Mix 15g (T4)","id":29638805520621,"position":1,"preview_image":{"aspect_ratio":1.25,"height":800,"width":1000,"src":"\/\/leoforward.com\/cdn\/shop\/products\/B07BS4V1B9.jpg?v=1650978554"},"aspect_ratio":1.25,"height":800,"media_type":"image","src":"\/\/leoforward.com\/cdn\/shop\/products\/B07BS4V1B9.jpg?v=1650978554","width":1000}],"requires_selling_plan":false,"selling_plan_groups":[],"content":"\u003ch3\u003eSolder Paste no clean Sn96.5\/Ag3.0\/Cu0.5 Two Part Mix 15g (T4)\u003c\/h3\u003e\n\u003cp id=\"b\"\u003eDescription Solder Paste No-Clean Lead-Free SAC305 T4 mesh 15g Two Part Mix.\nAlloy: Sn96.5\/Ag3.0\/Cu0.5 Flux Type: Synthetic No-Clean Flux Classification:\nREL0 Metal Content: 87% metal by weight. Particle Size: T4 (20-38 microns)\nMelting Point: 217-220C (423-428F) Size: 15g Two Part Mix Shelf Life Before\nMixed: Refrigerated \u0026gt;24 months, unrefrigerated \u0026gt;24 months After Mixed:\nRefrigerated \u0026gt;6 months, unrefrigerated \u0026gt;2 months Stencil Life \u0026gt;8 hours @\n20-50% RH 22-28C (72-82F) \u0026gt;4 hours @ 50-70% RH 22-28C (72-82F) Stencil\nCleaning Automated stencil cleaning systems for both stencil and misprinted\nboards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling\nBefore Mixed: Store refrigerated or at room temperature 3-25C (37-77F). Do not\nfreeze. After Mixed: Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4\nhours for solder paste to reach an operating temperature of 20-25C (68-77F)\nbefore use. Once mixed, the solder paste can be dispensed by cutting a small\ncorner off the bag. It can be resealed with a piece of tape, or it can be\nstored by dispensing the entire bag into the provided empty jar.\nTransportation This product has no shipping restrictions. Shipping below 0C\n(32F) or above 25C (77F) for normal transit times by ground or air will not\nimpact this product's stated shelf life.\u003c\/p\u003e \n\n\u003ch3\u003eProduct Features\u003c\/h3\u003e\n \u003cul class=\"a\"\u003e\n \u003cli\u003eLead-Free \/ RoHS Compliant\u003c\/li\u003e\n \u003cli\u003eTwo-Part Mix\u003c\/li\u003e\n \u003c\/ul\u003e\n\n\n\n\n"}

Solder Paste no clean Sn96.5/Ag3.0/Cu0.5 Two Part Mix 15g (T4)

In Stock. Leaves warehouse within 2 - 3 business days

$152.00 AUD
Maximum quantity available reached.
Free Shipping Australia Wide
100% Safe & Secure Checkout
100 Days Return Policy *
1 Year Warranty *

Solder Paste no clean Sn96.5/Ag3.0/Cu0.5 Two Part Mix 15g (T4)

Description Solder Paste No-Clean Lead-Free SAC305 T4 mesh 15g Two Part Mix. Alloy: Sn96.5/Ag3.0/Cu0.5 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 87% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 217-220C (423-428F) Size: 15g Two Part Mix Shelf Life Before Mixed: Refrigerated >24 months, unrefrigerated >24 months After Mixed: Refrigerated >6 months, unrefrigerated >2 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Before Mixed: Store refrigerated or at room temperature 3-25C (37-77F). Do not freeze. After Mixed: Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Once mixed, the solder paste can be dispensed by cutting a small corner off the bag. It can be resealed with a piece of tape, or it can be stored by dispensing the entire bag into the provided empty jar. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.

Product Features

  • Lead-Free / RoHS Compliant
  • Two-Part Mix

Related Products