BGA Activated Rosin Solder Paste Tin Rosin-Based Flux Paste Cream for Soldering Rework Station Circuit Board PCB BGA SMD Soldering Repair (80g)
BGA Activated Rosin Solder Paste Tin Rosin-Based Flux Paste Cream for Soldering Rework Station Circuit Board PCB BGA SMD Soldering Repair (80g)
APPLICABLE: Advanced Paste Flux Soldering for phone motherboard Repair, Electric Soldering Iron Welding Fluxes for phone circuit board repair DESIGN: Its boiling point only slightly higher than the melting point of the solder BRAND: MECHANIC High synthetic BGA Solder Flux Paste BGA Soldering Tin Cream MATERIAL: High bond strength, PH value neutral, insulation is strong, welding surface smooth WHAT YOU GET: 80G Solder Flux Paste with aluminum box BGA Solder Paste Tin Rosin Soldering Flux Paste Cleans and prevents oxidation Rosin Soldering Flux Paste Increases efficiency of the soldering process Rosin Soldering Flux Paste Allows solder to form strong, long lasting mechanical and electrical bonds Rosin Soldering Flux Paste Facilitates the flow of solder Read more
Product Features
- MECHANIC Advanced Paste Flux Soldering for mobile phone motherboard Repair, electric Soldering Iron Welding Fluxes for phone circuit board repair.
- Its boiling point only slightly higher than the melting point of the solder, For mobile phones, PC cards and other sophisticated electronic chip-level help welding.
- High bond strength, PH value neutral, insulation is strong, welding surface smooth, is no corrosive for IC and PCB.
- Wipe the surface of the object before soldering, apply the paste flux to the solder joint, solder the tin to the solder joint with soldering iron.
- Specifications: Model: MECHANIC-UV80; Color: Yellow, Weight: 0.08kg; Viscosity: 0.2Pas; Granularity: 0.22um; Packing: Aluminum box.