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Solder Paste in jar 250g (T5) SAC305 no clean

In Stock. Leaves warehouse in 2-3 business days

Brand: Chip Quik
$407.00 AUD
Maximum quantity available reached.
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Solder Paste in jar 250g (T5) SAC305 no clean

Description Solder Paste in jar 250g (T5) SAC305 no clean 88% metal. Alloy: Sn96.5/Ag3.0/Cu0.5 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 88% metal by weight. Particle Size: T5 (15-25 microns) Melting Point: 217-220C (423-428F) Size: 250g jar Shelf Life Refrigerated >6 months, unrefrigerated >2 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.

Product Features

  • Lead-Free / RoHS Compliant

Buy with confidence as this product comes with 18 months full local warranty in Australia & New Zealand (unless otherwise stated in the overview).

This product also comes with the benefits of the CocoonPower Warranty. For further details please read our Warranty Guidelines.

You can also purchase 3 Year Extended Care. If you are interested please see our Extended Care Information.

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